METAL FINISHING/PLATING CAPABILITIES
APC Technologies metal finishing capabilities include: rack, barrel and vibratory plating
Processes
Electroless Nickel Plating (low, mid & high phosphorous) Electrolytic Nickel Plating (Sulfamate/Sulfate)
Type I, II & III Gold Plating for electronics and semiconductor industries
Special cleaning processes for auto electronic & medical industry
Dedicated processing lines available
Passivation of stainless steel
Electroforming - a special process that allows metals to be deposited atom by atom into shapes that are difficult to achieve by other means. A dissolvable or melted substrate is removed after the electroformed material is deposited creating a finished shape.
Substrate Materials Plated
Kovar
Aluminum
Copper-Tungsten
Molybdenum
Steel
Stainless Steel
Brass
Tungsten
Other Services
Hydrogen Embrittlement Relief
Onsite chemistry lab
SPC capabilities
Thickness measurements by XRF
Special packaging (e.g. vacuum sealing)
Pickup & Delivery Available
